"To serve our customer better, Micropak is in the process of undertaking a major expansion.
Micropak is equipping it self to become a state of the art electronic manufacturing services provider.
Assembly and test equipment, utilizing the latest surface mount technology, is under the process of installation or on order. Targeted capabilities will be:

• 0201 placement
• Placement of fine pitch QFP's ( 0.3mm)
• Placement of BGA's and micro BGA's and CSP's
• Conformal Coating of entire PCB
• Capillary Underfill of BGAs
• Flying Probe fixtureless In-Circuit Testing
• Fixture In-Circuit Testing
• Functional Testing
• Boundry Scan Testing
• X-Ray Inspection"
  
  
  "SMT assembly equipment under installation at Micropak"

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"Please continue to visit this page for future installation pictures and news"