Troi7700H

Troi7700H

Pemtron

Combination of 2D & 3D inspection eliminates common shadow problem with SPI systems.Conventional SPI methods could only calculate heights above silk print levels, but by using patented color enhancing algorithm TROI™ could overcome these problems.In addition, a fully rotational 3D view of the solder form is displayed. This enables users to view a “life like’ image of the pad eliminating the need to extract the board from the line to view the defect under a microscope.The use of Linear X and Y stages, TROI™ provides a high accuracy under ±5μm.By improving the camera inspection speed, TROI™ show same performance as single projection.

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